Cadence Design Systems, Inc.


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Spring 2004
The transition from .13-micron to 90-nanometer technology was neither easy nor cheap. To stay on the leading edge, you can't even stop to catch your breath. Many companies are already thinking about how to implement 65-nm technology. In "Navigating 65-nm Design Limits," contributing editor Geoffrey James focuses on how this latest transition affects the efficiency of your design chain. As part of this 65-nm package, we asked Applied Materials CEO Mike Splinter for his thoughts on how companies can better prepare for this transition.
Spring 2004 Issue >>
Winter 2003
In a global economy, savvy companies reach across borders to find partners that will best add to and accentuate their own strengths. But, they also look up and down their particular design chain to find kindred spirits. Increasingly though, design chains require more than just one partner, driving companies to seek multiple partners. Electronics Design Chain has found that companies can combine their strengths to create a product that's greater than the sum of its parts, as a look at the articles in this issue will confirm.
Winter 2003 Issue >>
Summer 2003
Self-reinvention is one of the underlying themes of this issue of Electronics Design Chain. Our cover story examines how Taiwanese foundry giant TSMC is rewriting the rules of customer assistance by adding a smorgasbord of services (provided by other companies) to its silicon manufacturing buffet. Some of our other stories detail how companies are making radical changes to their business models in their efforts to succeed. We also take a look at the semiconductor and system-house design-chain link. Based on these stories, it's clear that reinvention is just another form of innovation.
Summer 2003 Issue >>
Spring 2003
In this issue, we highlight how some of the world's most successful companies-Sony, IBM, Toshiba, General Motors, Siemens, and Motorola-are preparing themselves to be in the best-possible position to take advantage of a recovery-whether they're collaborating on a new broadband chip or creating the automotive electronic subassemblies of the future.
Spring 2003 Issue >>
Winter 2002
In an era where fab costs exceed $2 billion and time-to-market is everything, sometimes it is in an organization's best interest to develop a product with a company that otherwise would be considered a competitor. Developing the skills to work with competitors has become a key requirement for top executives of chip, systems and software companies, as this issue demonstrates in stark relief.
Winter 2002 Issue >>
Fall 2002
In these days of volatile business conditions, the most effective and successful design chains are more than just a financial transaction-they include an exchange of intellectual property between partners. Our articles about Microsoft's Xbox design chain and the approach taken by Advanced Micro Devices in the optimization of its design chain speak volumes about the importance of exchanging more than just money.
Fall 2002 Issue >>
Summer 2002
The premier issue of Electronics Design Chain describes the innovative design chain optimization approach of networking leader Broadcom. In addition, we explain how a start-up fabless chipmaker first failed but later succeeded at optimizing a foundry relationship. Collectively, our articles provide insights by leaders at STMicroelectronics, National Semiconductor, Celestica, Flextronics, Texas Instruments and other major players about how they manage the use of intellectual property purchased from others. Furthermore, columnists Mike McGrath and Dr. Handel Jones offer compelling data and advice about how the industry can improve its design chain management.
Summer 2002 Issue >>
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